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| SM05 through SM36 PROTECTION PRODUCTS Description The SM series of transient voltage suppressors (TVS) are designed to protect components which are connected to data and transmission lines from voltage surges caused by electrostatic discharge (ESD), electrical fast transients (EFT), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The dual-junction common-anode design allows the user to protect one bidirectional data line or two unidirectional lines. The low profile SOT23 package allows flexibility in the design of "crowded" circuit boards. The SM series will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, "Human Body Model" for air and contact discharge. TVS Diode Array Features 300 watts peak pulse power (tp = 8/20s) Transient protection for data & power lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20s) Protects one bidirectional line or two unidirectional lines Working Voltages: 5V, 12V, 15V, 24 and 36V Low clamping voltage Solid-state silicon avalanche technology Mechanical Characteristics JEDEC SOT23 package Molding compound flammability rating: UL 94V-0 Marking : Marking Code Packaging : Tape and Reel per EIA 481 Applications Cellular Handsets and Accessories Portable Electronics Industrial Controls Set-Top Box Servers, Notebook, and Desktop PC Circuit Diagram Schematic & PIN Configuration SOT23 (Top View) Revision 07/12/04 1 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Power (tp = 8/20s) Thermal Resistance, Junction to Ambient Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbol Pp k J A TL TJ TSTG Value 300 556 260 (10 sec.) -55 to +125 -55 to +150 Units Watts C/W C C C Electrical Characteristics SM05 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Peak Pulse Current Junction Cap acitance Junction Cap acitance Symbo l VRWM V BR IR VC IP P Cj Cj It = 1mA VRWM = 5V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Pi n 1 to 2 VR = 0V, f = 1MHz Pin 1 to 3 and Pi n 2 to 3 VR = 0V, f = 1MHz 6 20 9.8 17 350 400 Co nditio ns Minimum Typical Maximum 5 Units V V A V A pF pF SM12 Par ame te r Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Peak Pulse Current Junction Cap acitance Junction Cap acitance Symbo l VRWM V BR IR VC IP P Cj Cj It = 1mA VRWM = 12V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Pi n 1 to 2 VR = 0V, f = 1MHz Pin 1 to 3 and Pi n 2 to 3 VR = 0V, f = 1MHz 13.3 1 19 12 120 150 Co nditio ns Minimum Typical Maximum 12 Units V V A V A pF pF 2004 Semtech Corp. 2 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Electrical Characteristics (Continued) SM15 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Peak Pulse Current Junction Cap acitance Junction Cap acitance Symbol VRWM V BR IR VC IP P Cj Cj It = 1mA VRWM = 15V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Pi n 1 to 2 VR = 0V, f = 1MHz Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 16.7 1 24 10 75 100 Conditions Minimum Typical Maximum 15 Units V V A V A pF pF SM24 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Peak Pulse Current Junction Cap acitance Junction Cap acitance Symbol VRWM V BR IR VC IP P Cj Cj It = 1mA VRWM = 24V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Pi n 1 to 2 VR = 0V, f = 1MHz Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 26.7 1 43 5 50 60 Conditions Minimum Typical Maximum 24 Units V V A V A pF pF SM36 Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamp ing Voltage Peak Pulse Current Junction Cap acitance Junction Cap acitance 2004 Semtech Corp. Symbol VRWM V BR IR VC IP P Cj Cj Conditions Minimum Typical Maximum 36 Units V V It = 1mA VRWM = 36V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Pi n 1 to 2 VR = 0V, f = 1MHz Pin 1 to 3 and 2 to 3 VR = 0V, f = 1MHz 3 40 1 60 4 40 45 A V A pF pF www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 Peak Pulse Power - Ppk (kW) 110 100 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0 Power Derating Curve 1 0.1 0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000 0 25 50 75 100 o 125 150 Ambient Temperature - TA ( C) Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 T im e (s) 20 25 30 td = I PP /2 e -t W aveform Parameters: tr = 8s td = 20s ESD Pulse Waveform (Per IEC 61000-4-2) Level IEC 61000-4-2 Discharge Parameters First Peak Current (A ) 1 2 3 4 7.5 15 22.5 30 Peak Current at 30 ns (A ) 4 8 12 16 Peak Current at 60 ns (A ) 8 4 6 8 Test Test Voltage Voltage (Contact (A ir Discharge) Discharge) ( kV ) (kV) 2 4 6 8 2 4 8 15 2004 Semtech Corp. 4 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Applications Information Device Connection Options The SM series is designed to protect one bidirectional or two unidirectional data or I/O lines operating at 5 to 36 volts. Connection options are as follows: Bidirectional: Pin 1 is connected to the data line and pin 2 is connected to ground (Since the device is symmetrical, these connections may be reversed). The ground connection should be made directly to a ground plane. The path length should be kept as short as possible to minimize parasitic inductance. Pin 3 is not connected. Unidirectional: Data lines are connected to pin 1 and pin 2. Pin 3 is connected to ground. For best results, this pin should be connected directly to a ground plane on the board. The path length should be kept as short as possible to minimize parasitic inductance. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of fast rise-time transients such as ESD. The following guidelines are recommended (Refer to application note SI99-01 for more detailed information): Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2004 Semtech Corp. 5 www.semtech.com Device Schematic & Pin Configuration RS-232 Transceiver Protection Example SM05 through SM36 PROTECTION PRODUCTS Outline Drawing - SOT23 D e1 3 A DIM H B A A1 A2 b c D E E1 e e1 L L1 N 0 aaa bbb DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .035 .000 .035 .012 .003 .110 .082 .047 .015 0 .037 .114 .093 .051 .075 .037 .020 .022 3 .004 .008 .044 .004 .040 .020 .007 .120 .104 .055 .024 8 0.89 1.12 0.01 0.10 0.88 0.95 1.02 0.30 0.51 0.08 0.18 2.80 2.90 3.04 2.10 2.37 2.64 1.20 1.30 1.40 1.90 BSC 0.95 BSC 0.40 0.50 0.60 (0.55) 3 0 8 0.10 0.20 E1 E SEATING PLANE C GAUGE PLANE 0.25 L L1 DETAIL A 0 c 1 2 bxN e bbb CAB A A2 3X aaa C SEATING PLANE SIDE VIEW SEE DETAIL A A1 C NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS -A- AND -BTO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. Land Pattern - SOT23 X Y DIM Z G C C E E1 G X Y Z DIMENSIONS INCHES MILLIMETERS (.087) .037 .075 .031 .039 .055 .141 (2.20) 0.95 1.90 0.80 1.00 1.40 3.60 Y E E1 NOTES: 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 2. REFERENCE IPC-SM-782A. 2004 Semtech Corp. 6 www.semtech.com SM05 through SM36 PROTECTION PRODUCTS Marking Codes Part Number SM05 SM12 SM15 SM24 SM36 Marking Code M05 M12 M15 M24 M36 Ordering Information Part Number SM05.TC SM12.TC SM15.TC SM24.TC SM36.TC SM05.TCT SM12.TCT SM15.TCT SM24.TCT SM36.TCT Lead Finish SnPb SnPb SnPb SnPb SnPb Pb Free Pb Free Pb Free Pb Free Pb Free Qty per Reel 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 3,000 R eel Size 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch 7 Inch Contact Information Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com 2004 Semtech Corp. 7 |
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